TecClay medium, sulfur-free, bar approx. 0.58kg, R&G # 310125-1

TecClay is absolutely sulfur-free, approx. 40% lighter than conventional clays, so even larger models remain easily transportable. The processing temperature is between 40 - 55 °C, significantly lower than with standard clay. In addition, TecClay stores heat longer, meaning it remains workable for longer.

TecClay is very temperature stable and binds excellently: preheated TecClay adheres even in wafer-thin layers to the substrate, preheating the substrate is not necessary. For a glossy surface, it is sufficient to polish the material with a cotton cloth or a blade; the use of foil is eliminated.

TecClay has excellent processing properties: It is absolutely odorless, oxidation-free, air bubble-free and very hard on the surface. This makes it extremely dimensionally stable and very easy to mill. The chip is dry and falls off the tool. In addition, TecClay is extremely tough, so that other materials can be attached very well with screws or nails.

Although TecClay is sulfur-free, it should not be molded with addition-curing silicones, because TecClay contains iron oxide colorants that act as inhibitors when in contact with these silicones. Therefore, we recommend molding clay models only with condensation-curing silicones, as the inhibition risks are significantly lower with these.

• TecClay Medium, sulfur-free 8433 TMC
• Color: Brown
• Weight-reduced
• Sulfur-free
• 40% lighter than standard clay
• Ideal for large and heavy models
• Smooth and easy to process
• Odorless
• Very good tape adhesion
• Rectangular bar shape
• Bar profile: 6.0 x 5.4 cm
• Bar length: 22 cm
• Bar weight: approx. 580 g